Verify the direction (position) of irregular shaped parts.

Measure the inner diameter of parts by inch or milimeters.

Verify the burr of a plastic parts or a mold.

Auto-detect and distribute the mixed parts.

Conveyed by prevention of deformation such as resin ring etc.

Convey and measure the dimension of the lead on chip.

Convey and scratch resistant of automotive engine parts.

Molding process of glass container.

Measure the extended force of O-ring at the process of convey.

Convey and measure the dimensions of different soft and light parts.

Convey and cut the electronic and semiconductor wire.

Connector lug testing process.

Convey the small wafer or chip that unrealized by vacuum method.

THE POSSIBILITY OF ELECTRIC GRIPPER [ESG1 SERIES]